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1N5935B 10N60 CRO2065B Z89304 LVCH16 1N474 15KPA 4066D
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  29.10.2012 xml -365-sd 1 of 2 xml -365- sd technical data uv led array, smd xml -365- sd is an ultra high power multi emitter led array, utilizing 25 led chip dies on a ceramic smd submount and uv resistant silicone resin lens. it complies with rohs directive drawing & electrical la yout dimensions in mm absolute maximum ratings (t a =25c) item symbol value unit dc forward current i f 350 ma power dissipation * 2 p d 8.75 w operating temperature t op - 25 +80 c storage temperature t stg - 30 + 10 0 c soldering temperature * 1 t sol 260 c * note: 1. for 3 sec. 2. 5c/w heat sink required specifications (if=300ma, t a =25c) item symbol min. typ. max. unit electrical specification forward voltage u f 18 21 25 v optical specification optical p ower * 1 p o - 2 00 - mw peak wavelength * 2 p 3 63 - 370 nm spectral half width (fwhm) 10 - 20 nm viewing angle 1 35 deg. * note: 1. measurement tolerance is 10% 2. measurement tolerance is 2 nm
29.10.2012 xml -365-sd 2 of 2 spectrum (ta=25c, i f =300 ma) directive characteristics (ta=25c) precaution for use 1. caution s ? this device is a uv led, which radiates intense uv light during operation. ? do not look directly into the uv light or look through the optical system. to prevent inadequate exposure of uv radiation, wearing uv protective glasses is recommended 2. static ele ctricity ? the leds are very sensitive to static electricity and surge voltage. so it is recommended that a wrist band or an anti - electrostatic glove be used when handling the leds. ? all devices, equipment and machinery must be grounded properly. it is recommended that precautions should be taken against surge voltage to the equipment that mounts the leds. 3. heat generation ? thermal design of the end product is of paramount importance. please consider the heat generation of the led when making the system design. the coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of led placement on the board, as well as other components. it is necessary to avoid intense heat gener ation and operate within the maximum ratings given in the specification. ? the operating current should be considered taking into account the environmental temperature and the capacity of the cooling solution


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